A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.