发明授权
- 专利标题: Power module
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申请号: US16513919申请日: 2019-07-17
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公开(公告)号: US10832995B2公开(公告)日: 2020-11-10
- 发明人: Ronald Eisele , Frank Osterwald
- 申请人: Danfoss Silicon Power GmbH
- 申请人地址: DE Flensburg
- 专利权人: Danfoss Silicon Power GmbH
- 当前专利权人: Danfoss Silicon Power GmbH
- 当前专利权人地址: DE Flensburg
- 代理机构: McCormick, Paulding & Huber PLLC
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1dbfdc2a
- 主分类号: H01L21/56
- IPC分类号: H01L21/56 ; H01L23/495 ; H01L23/29 ; H01L23/433 ; H01L23/31
摘要:
A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate(40).
公开/授权文献
- US20190341341A1 POWER MODULE 公开/授权日:2019-11-07