发明授权
- 专利标题： Film processing unit, substrate processing apparatus and substrate processing method
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申请号： US15772229申请日： 2016-10-27
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公开(公告)号： US10854480B2公开(公告)日： 2020-12-01
- 发明人: Yuji Tanaka , Masaya Asai , Masahiko Harumoto , Koji Kaneyama
- 申请人： SCREEN HOLDINGS CO., LTD.
- 专利权人： SCREEN Holdings Co., Ltd.
- 当前专利权人： SCREEN Holdings Co., Ltd.
- 代理机构： Ostrolenk Faber LLP
- 优先权： JP2015-220496 20151110
- 国际申请： PCT/JP2016/081851 WO 20161027
- 国际公布： WO2017/082065 WO 20170518
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; G03F7/16 ; B05B1/28 ; B05C11/02 ; H01L21/677 ; H01L21/687 ; G03F7/09 ; G03F7/004 ; G03F7/30
摘要：
A substrate is held and rotated by a spin chuck, and a coating liquid is discharged to the substrate. The coating liquid that is splashed outwardly from the substrate is received by an outer cup. A cleaning liquid that has been discharged from a cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a first guide to clean the outer cup. Thus, the coating liquid, its solidified matter and the like adhering to the outer cup are dissolved and removed from the outer cup. Subsequently, a metal removal liquid that has been discharged from the cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a second guide. Thus, a metallic component remaining on the outer cup is dissolved and removed from the outer cup.
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