Invention Grant
- Patent Title: Cooling for slot mounted electrical modules
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Application No.: US15892101Application Date: 2018-02-08
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Publication No.: US10856446B2Publication Date: 2020-12-01
- Inventor: Franklin D. Boyden , Jimmy Chun-Chuen Leung
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.
Public/Granted literature
- US20190246523A1 COOLING FOR SLOT MOUNTED ELECTRICAL MODULES Public/Granted day:2019-08-08
Information query
