Invention Grant
- Patent Title: Three-dimensional object substructures
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Application No.: US16556657Application Date: 2019-08-30
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Publication No.: US10857736B2Publication Date: 2020-12-08
- Inventor: Peter Morovic , Jan Morovic , Alejandro Manuel De Pena , Juan Manuel Garcia Reyero Vinas
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Priority: WOPCT/US2015/013841 20150130
- Main IPC: B29C64/386
- IPC: B29C64/386 ; B33Y50/02 ; H04N1/405 ; B29C64/393 ; G05B19/4099 ; H04N1/52 ; B33Y50/00

Abstract:
Methods and apparatus relating to substructures for three-dimensional objects are described. In an example, a processing apparatus includes: an interface to receive data representing a three-dimensional model object, the data including object model data and object property data; a mapping module to map received data to a print material coverage representation; a halftone module to provide halftone threshold data; and a substructure module to define a substructure for a three-dimensional object to be generated, the substructure specifying in at least a region thereof a consistent lattice structure and a variable material distribution. The apparatus is to apply a substructure and a halftoning to the print material coverage representation to generate control data for the production of a three-dimensional object having the substructure.
Public/Granted literature
- US20190381734A1 THREE-DIMENSIONAL OBJECT SUBSTRUCTURES Public/Granted day:2019-12-19
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