Invention Grant
- Patent Title: Substrate inspection apparatus and substrate processing system including the same
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Application No.: US15952317Application Date: 2018-04-13
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Publication No.: US10861724B2Publication Date: 2020-12-08
- Inventor: Jongwoo Sun , Hakyoung Kim , Yun-Kwang Jeon , Wonyoung Jee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2017-0116773 20170912
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01J37/32

Abstract:
Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.
Public/Granted literature
- US20190080944A1 SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME Public/Granted day:2019-03-14
Information query
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