Invention Grant
- Patent Title: Floating die package
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Application No.: US15248151Application Date: 2016-08-26
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Publication No.: US10861796B2Publication Date: 2020-12-08
- Inventor: Benjamin Stassen Cook , Steven Kummerl , Kurt Peter Wachtler
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/495 ; H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L21/78
Abstract:
A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.
Public/Granted literature
- US20170330841A1 Floating Die Package Public/Granted day:2017-11-16
Information query
IPC分类:
