Invention Grant
- Patent Title: Heatsink with retention mechanisms
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Application No.: US16149100Application Date: 2018-10-01
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Publication No.: US10882147B2Publication Date: 2021-01-05
- Inventor: Andrew Potter , Daniel W Tower , James Schulze , John Grady , Sunil Ganta , Chong Tan
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: F28F7/00
- IPC: F28F7/00 ; B23P19/04 ; H05K7/20

Abstract:
Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.
Information query