Invention Grant
- Patent Title: Production of a multi-chip component
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Application No.: US16072993Application Date: 2017-01-26
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Publication No.: US10886145B2Publication Date: 2021-01-05
- Inventor: Michael Zitzlsperger , Tobias Gebuhr , Stephan Eicher
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: DE102016101526 20160128
- International Application: PCT/EP2017/051681 WO 20170126
- International Announcement: WO2017/129698 WO 20170803
- Main IPC: H01L21/40
- IPC: H01L21/40 ; H01L23/495 ; H01L21/48 ; H01L23/00 ; H01L23/31 ; H01L33/62 ; H01L33/52 ; H01L21/56 ; H01L33/00 ; H01L33/48 ; H01L25/075

Abstract:
A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.
Public/Granted literature
- US20190035972A1 PRODUCTION OF A MULTI-CHIP COMPONENT Public/Granted day:2019-01-31
Information query
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