公开(公告)号：US20190009441A1

公开(公告)日：2019-01-10

申请号：US15752455

申请日：2016-08-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stephan Eicher ,  Martin Brandl ,  Markus Boss

IPC: B29C45/14 ,  H01L33/48 ,  H01L23/00

Abstract: A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.

公开(公告)号：US10886145B2

公开(公告)日：2021-01-05

申请号：US16072993

申请日：2017-01-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Tobias Gebuhr ,  Stephan Eicher

IPC: H01L21/40 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L33/62 ,  H01L33/52 ,  H01L21/56 ,  H01L33/00 ,  H01L33/48 ,  H01L25/075

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.