Invention Grant
- Patent Title: Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems
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Application No.: US16464678Application Date: 2016-12-30
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Publication No.: US10886606B2Publication Date: 2021-01-05
- Inventor: Telesphor Kamgaing , Sasha N. Oster , Georgios C. Dogiamis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2016/069621 WO 20161230
- International Announcement: WO2018/125240 WO 20180705
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q21/00 ; H01Q1/24 ; H01Q21/22 ; H01L23/66 ; H01L23/522 ; H01Q9/04 ; H01Q19/22 ; H01L23/498 ; H01Q1/22 ; H01Q21/06
Abstract:
Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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