Invention Grant
- Patent Title: Method for manufacturing a printed circuit board including an embedded electronic component
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Application No.: US15993107Application Date: 2018-05-30
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Publication No.: US10887995B2Publication Date: 2021-01-05
- Inventor: Seung Eun Lee , Yee Na Shin , Yul Kyo Chung , Doo Hwan Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0155031 20121227
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H05K3/46 ; H01L21/56

Abstract:
A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.
Public/Granted literature
- US20180279478A1 PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-09-27
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