- 专利标题: Methods and apparatus for embedding heating circuits into articles made by additive manufacturing and articles made therefrom
-
申请号: US15938597申请日: 2018-03-28
-
公开(公告)号: US10889056B2公开(公告)日: 2021-01-12
- 发明人: Eduardo Barocio , Robert Byron Pipes , Bastian Brenken , Anthony Jordan Favaloro , Nicholas Mario DeNardo
- 申请人: Purdue Research Foundation
- 申请人地址: US IN West Lafayette
- 专利权人: Purdue Research Foundation
- 当前专利权人: Purdue Research Foundation
- 当前专利权人地址: US IN West Lafayette
- 代理机构: Purdue Research Foundation
- 主分类号: B29C64/165
- IPC分类号: B29C64/165 ; B29C33/06 ; B29C64/118 ; B29C33/38 ; B33Y30/00 ; B29C64/295 ; B29C70/38 ; B29C64/209 ; B29L31/00 ; B33Y80/00 ; B29K81/00 ; B29K705/08 ; B33Y10/00
摘要:
Methods of embedding a heating circuit in an article fabricated by additive manufacturing. The methods describe techniques such as co-extruding a wire, capable of being heated, along with print material in additive manufacturing of the article, and placing a pre-shaped wire capable of being heated between adjacent layers of the article. A third method includes dispensing a wire, capable of being heated, during the additive manufacturing of the article, and compacting the wire into the printed material. An apparatus for embedding a heating circuit in an article fabricated by additive manufacturing. The apparatus contains a wire dispenser, a cutter to control the length of the wire dispensed, and a compactor capable of embedding the wire capable of being heated into the printed material. An article made by additive manufacturing is disclosed. The article contains at least one heating element embedded in the article during the additive manufacturing process.