Invention Grant
- Patent Title: Hardware component detections
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Application No.: US16481873Application Date: 2017-06-21
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Publication No.: US10891247B2Publication Date: 2021-01-12
- Inventor: Christopher Rijken , Chih Liang Li , Ronald E. Deluga
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Tong Rea Bentley & Kim LLC (US LC)—USD
- International Application: PCT/US2017/038424 WO 20170621
- International Announcement: WO2018/236363 WO 20181227
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/12 ; G06F13/42

Abstract:
In example implementations, an apparatus for detecting hardware components is provided. The apparatus includes a multipurpose integrated circuit comprising an input pin, a hardware component coupled to the input pin and a two-way communication bus coupled to the multipurpose integrated circuit. The multipurpose integrated circuit is to receive an interrogation signal from a processor for the hardware component coupled to the pin via the two-way communication bus. A response signal that indicates that the hardware component is detected on the pin is generated in response to the interrogation signal. The response signal is then transmitted to the processor over the two-way communication bus.
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