Invention Grant
- Patent Title: Method for manufacturing resistor
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Application No.: US16771334Application Date: 2018-12-11
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Publication No.: US10892074B2Publication Date: 2021-01-12
- Inventor: Yuichi Abe , Seiji Karasawa , Michio Kubota , Yoji Gomi , Koichi Minowa
- Applicant: KOA CORPORATION
- Applicant Address: JP Ina
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Ina
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2017-237821 20171212
- International Application: PCT/JP2018/045457 WO 20181211
- International Announcement: WO2019/117128 WO 20190620
- Main IPC: H01C17/28
- IPC: H01C17/28

Abstract:
An object is to provide a method for manufacturing a resistor capable of suppressing variations in the thickness of a thermally conductive layer interposed between a resistive body and electrode plates. The method for manufacturing a resistor according to the present invention includes a step of forming an unhardened thermally conductive layer on a surface of a resistive body, a step of bringing the thermally conductive layer into a semi-hardened state, and a step of bending electrode plates respectively disposed at both sides of the resistive body, further hardening the thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the thermally conductive layer.
Public/Granted literature
- US20200343028A1 METHOD FOR MANUFACTURING RESISTOR Public/Granted day:2020-10-29
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