CHIP-TYPE CURRENT FUSE
    1.
    发明公开

    公开(公告)号:US20240282537A1

    公开(公告)日:2024-08-22

    申请号:US18653678

    申请日:2024-05-02

    申请人: KOA CORPORATION

    IPC分类号: H01H37/76

    CPC分类号: H01H37/761

    摘要: The chip-type current fuse is configured to include a fuse element 5 formed between a first front electrode 3 and a second front electrode 4. The fuse element 5 includes: a first linear portion 5a that has an end connected to the first front electrode 3 and extends in a direction toward the second front electrode 4; a second linear portion 5b that has an end connected to the second front electrode 4 and extends in parallel to the first linear portion 5a in a direction toward the first front electrode 3; and an inclined linear portion 5c that links the first linear portion 5a and the second linear portion 5b to each other. The inclined linear portion 5c is connected at an acute angle to each of the first linear portion 5a and the second linear portion 5b.

    CURRENT DETECTION DEVICE
    2.
    发明公开

    公开(公告)号:US20240248119A1

    公开(公告)日:2024-07-25

    申请号:US18559922

    申请日:2022-04-22

    申请人: KOA CORPORATION

    发明人: Ryou Osawa

    IPC分类号: G01R1/20 G01R19/00

    CPC分类号: G01R1/203 G01R19/0092

    摘要: The present invention relates to a current detection device, in particular a current detection device using a shunt resistor. The current detection device (30) includes a resistive element (5) and a pair of electrodes (6, 7). The electrodes (6, 7) have detection areas (24a, 25a) demarcated by first slits (16, 17), second slits (26, 27), and contact surfaces (6a, 7a) that at least partially contacts the resistive element (5). The electrodes (6, 7) further have voltage detection portions (20, 21) arranged in the detection areas (24a, 25a).

    CHIP RESISTOR AND METHOD OF PRODUCING THEREOF

    公开(公告)号:US20230335317A1

    公开(公告)日:2023-10-19

    申请号:US18126517

    申请日:2023-03-27

    申请人: KOA CORPORATION

    发明人: Taro KIMURA

    IPC分类号: H01C1/142

    CPC分类号: H01C1/142

    摘要: A chip resistor 10 comprises: a insulating substrate 1; a pair of upper surface electrodes 2; a resistor 3; a pair of lower surface electrodes 5; a pair of resin electrode layers 6 made of synthetic resin materials containing conductive particles and laminated on the pair of lower surface electrodes 5; a pair of end face electrodes 7; and a pair of external electrodes 8, wherein the pair of the lower surface electrodes 5 is made of metal thin film layers formed as thin films on a mounting surface of the insulating substrate 1, respectively, and includes exposed portions 5a exposed from the resin electrode layers 6, respectively, and the pair of external electrodes 8 is in contact with the exposed portions 5a of the lower surface electrodes 5 and entire surfaces of the resin electrode layers 6, respectively. [Selected drawing] FIG. 1

    Chip resistor
    9.
    发明授权

    公开(公告)号:US11742116B2

    公开(公告)日:2023-08-29

    申请号:US17741568

    申请日:2022-05-11

    申请人: KOA CORPORATION

    IPC分类号: H01C7/22

    CPC分类号: H01C7/22

    摘要: The resistor 5 is a print-formed body including a meandering shaped first region 8 connected to the first front electrode 3 and a second region 9 connected to the first region 8 via a linking portion 10 and connected to the second front electrode 4. The first region 8 is provided with an I-cut shaped first trimming groove 11 and the second region 9 is provided with an L-cut shaped second trimming groove 12, and the side of the second region 9 positioned in the direction toward which a turn portion 12b of the second trimming groove 12 extends is an oblique side 9a that inclines to approach the second front electrode 4 as it approaches the connecting portion 7.

    SHUNT RESISTOR AND CURRENT DETECTION APPARATUS

    公开(公告)号:US20230187105A1

    公开(公告)日:2023-06-15

    申请号:US18079245

    申请日:2022-12-12

    申请人: KOA CORPORATION

    发明人: Ryou Osawa

    摘要: A shunt resistor capable of reducing an absolute value of a temperature coefficient of resistance is disclosed. The shunt resistor includes: a base structure including a resistance element and a pair of electrodes; a bridge structure configured to bridge the pair of electrodes and made of a conductor; and connections configured to couple the pair of electrodes to the bridge structure. The bridge structure has a higher resistance than a resistance of the base structure at the connections.