Invention Grant
- Patent Title: Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium
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Application No.: US16813530Application Date: 2020-03-09
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Publication No.: US10893607B2Publication Date: 2021-01-12
- Inventor: Kenji Iwamoto , Satoshi Kurosawa
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2018-139791 20180725
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K3/28 ; H05K1/03 ; H05K1/18 ; H05K3/46
Abstract:
A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.
Public/Granted literature
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