Invention Grant
- Patent Title: Electrostatic chucks and substrate processing apparatus including the same
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Application No.: US16248328Application Date: 2019-01-15
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Publication No.: US10896838B2Publication Date: 2021-01-19
- Inventor: Minsung Kim , Myoung Soo Park , Dougyong Sung , Yun-Kwang Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0031014 20160315
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; H01L21/67

Abstract:
An electrostatic chuck includes a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base. The chuck further includes an upper heater section including upper heaters between the lower heaters and the chuck electrode, and a upper ground electrode between the upper heaters and the lower heaters, and a plurality of via contact electrodes connecting the upper ground electrode into the lower ground electrode.
Public/Granted literature
- US20190148205A1 ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2019-05-16
Information query
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