发明授权
- 专利标题: Diode structures
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申请号: US16382718申请日: 2019-04-12
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公开(公告)号: US10896953B2公开(公告)日: 2021-01-19
- 发明人: Jagar Singh , Shiv Kumar Mishra
- 申请人: GLOBALFOUNDRIES INC.
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Roberts Calderon Safran & Cole, P.C.
- 代理商 Francois Pagette; Andrew M. Calderon
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/872 ; H01L27/06
摘要:
The present disclosure relates to semiconductor structures and, more particularly, to high voltage diode structures and methods of manufacture. The structure includes: a diode structure composed of first well of a first dopant type in a substrate; and a well ring structure of the first dopant type in the substrate which completely surrounds the first well of the first dopant type, and spaced a distance “x” from the first well to cut a leakage path to a shallower second well of a second dopant type.
公开/授权文献
- US20200328272A1 DIODE STRUCTURES 公开/授权日:2020-10-15
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