Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board
Abstract:
A metal-clad laminate includes: a cured insulating layer including a polyphenylene ether compound; a metal layer joined with the insulating layer; and an intermediate layer interposed between the insulating layer and the metal layer, the intermediate layer including a silane compound. The metal layer has a junction surface that is joined with the insulating layer via the intermediate layer. The junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive.
Information query
Patent Agency Ranking
0/0