Invention Grant
- Patent Title: Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board
-
Application No.: US15322393Application Date: 2015-07-07
-
Publication No.: US10897818B2Publication Date: 2021-01-19
- Inventor: Yuki Kitai , Hiroaki Fujiwara
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-146142 20140716
- International Application: PCT/JP2015/003396 WO 20150707
- International Announcement: WO2016/009611 WO 20160121
- Main IPC: H05K1/05
- IPC: H05K1/05 ; B32B15/08 ; C08G65/48 ; C08L71/12 ; B32B27/00 ; B32B27/26 ; B32B15/14 ; B32B5/02 ; B32B15/12 ; B32B29/00 ; B32B7/04 ; B32B15/20 ; H05K3/38 ; H05K1/03

Abstract:
A metal-clad laminate includes: a cured insulating layer including a polyphenylene ether compound; a metal layer joined with the insulating layer; and an intermediate layer interposed between the insulating layer and the metal layer, the intermediate layer including a silane compound. The metal layer has a junction surface that is joined with the insulating layer via the intermediate layer. The junction surface has a ten-point average roughness Rz ranging from 0.5 μm to 4 μm inclusive.
Public/Granted literature
- US20170164469A1 METAL-CLAD LAMINATE, METHOD FOR PRODUCING SAME, METAL FOIL WITH RESIN, AND PRINTED WIRING BOARD Public/Granted day:2017-06-08
Information query