An electronics assembly drives an electric motor and receives a coolant fluid. The electronics assembly includes a heat sink including a thermally conductive material. The heat sink includes a frame extending between a first surface and a second surface. The first surface defines at least a portion of a cavity for receiving the coolant fluid therein. The heat sink includes a plurality of cooling members coupled to and extending from the first surface of the frame into the cavity such that the plurality of cooling members are disposed within the coolant fluid. The electronics assembly further includes an electrical insulator directly bonded to the second surface of the frame and a semiconductor thermally coupled to the electrical insulator. The electrical insulator is a thermal conductor and facilitates heat transfer between the semiconductor and the heat sink. The electrical insulator electrically insulates the semiconductor from the heat sink.