- Patent Title: Enhanced physical layer performance by inter-service information
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Application No.: US16243820Application Date: 2019-01-09
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Publication No.: US10904725B2Publication Date: 2021-01-26
- Inventor: Tien Viet Nguyen , Sudhir Kumar Baghel , Kapil Gulati , Shailesh Patil , Libin Jiang , Zhibin Wu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P
- Main IPC: H04W4/44
- IPC: H04W4/44 ; H04B7/00 ; H04B7/0413 ; H04B7/06 ; H04L5/00 ; H04L12/18 ; H04L12/24 ; H04W4/02 ; H04W72/02 ; H04W72/04
Abstract:
In an example, a method for wireless communications by a first wireless device, is disclosed comprising obtaining information regarding an environment for wireless communications between the first wireless device and at least one second wireless device and adjusting one or more operating parameters for the wireless communications, based on the information. As described herein, information from one service or application in a first RAT is used by the first wireless device to enhance performance in another service or application in a second RAT by the first wireless device.
Public/Granted literature
- US20190222985A1 ENHANCED PHYSICAL LAYER PERFORMANCE BY INTER-SERVICE INFORMATION Public/Granted day:2019-07-18
Information query
