Invention Grant
- Patent Title: Methods for attachment and devices produced using the methods
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Application No.: US14027530Application Date: 2013-09-16
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Publication No.: US10905041B2Publication Date: 2021-01-26
- Inventor: Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
- Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
- Applicant Address: US NJ South Plainfield
- Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee Address: US NJ South Plainfield
- Agency: Stinson LLP
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H05K13/04 ; H01L23/00

Abstract:
Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
Public/Granted literature
- US20140153203A1 METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS Public/Granted day:2014-06-05
Information query
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