Invention Grant
- Patent Title: Electronic component
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Application No.: US16202058Application Date: 2018-11-27
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Publication No.: US10910155B2Publication Date: 2021-02-02
- Inventor: Won Chul Sim , Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0122489 20181015
- Main IPC: H01G2/06
- IPC: H01G2/06 ; H01G4/232 ; H01G4/018 ; H01G4/30 ; H05K3/30 ; H05K1/18 ; H01G4/012

Abstract:
An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.
Information query