Invention Grant
- Patent Title: Etchant composition, and method for manufacturing metal pattern and array substrate using the same
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Application No.: US16356551Application Date: 2019-03-18
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Publication No.: US10910412B2Publication Date: 2021-02-02
- Inventor: Bong-Kyun Kim , Jinsuek Kim , Seungbo Shim , Shinhyuk Choi , Woonhyung Shim , Donghee Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2018-0031722 20180319
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/3213 ; G02F1/1362 ; C09K13/06 ; C09K13/08

Abstract:
An etchant composition including a persulfate, a four-nitrogen ring compound, a carbonyl ring compound having two or more carbonyl groups, and water, and having a weight ratio of the four-nitrogen ring compound and the carbonyl ring compound of about 1:0.1 to about 1:2. The etchant composition may etch a multilayer of titanium/copper and may be used for manufacturing a metal pattern and an array substrate having excellent properties of an etched pattern.
Public/Granted literature
- US20190288015A1 ETCHANT COMPOSITION, AND METHOD FOR MANUFACTURING METAL PATTERN AND ARRAY SUBSTRATE USING THE SAME Public/Granted day:2019-09-19
Information query
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