Invention Grant
- Patent Title: Integrated multi-chamber heat exchanger
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Application No.: US15723365Application Date: 2017-10-03
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Publication No.: US10914535B2Publication Date: 2021-02-09
- Inventor: David L. Vos , Ryan M. Alderfer , Randall J. Stutzman
- Applicant: Lockheed Martin Corporation
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Baker Botts L.L.P.
- Main IPC: F28F7/02
- IPC: F28F7/02 ; B23P15/26 ; B33Y80/00 ; H01L23/473 ; F28F1/02 ; H01L23/427

Abstract:
A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.
Public/Granted literature
- US20180043480A1 INTEGRATED MULTI-CHAMBER HEAT EXCHANGER Public/Granted day:2018-02-15
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