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    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
    1.
    发明申请
    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS 审中-公开

    公开(公告)号：US20160278240A1

    公开(公告)日：2016-09-22

    申请号：US15169827

    申请日：2016-06-01

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS
    5.
    发明申请
    FLUID-FLOW-THROUGH COOLING OF CIRCUIT BOARDS 有权
    电流板流体流动冷却

    公开(公告)号：US20150230365A1

    公开(公告)日：2015-08-13

    申请号：US14175377

    申请日：2014-02-07

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20563 ,  B23P15/26 ,  H05K7/20272 ,  H05K7/2039 ,  H05K7/20763 ,  Y10T29/4935

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

    Abstract translation: 用于传导冷却卡组件的公开的装置可以包括框架，该框架包括适于接合用于至少一个电路卡的导电冷却框架的相对侧上的相应热管理接口的第一和第二导热部分。 该装置还可以包括在框架中在第一和第二开口之间延伸的通道，以便使冷却流体流入第一开口，通过该通道，并流出第二开口。 根据所公开的方法，插入件可以安装在夹层连接器的部件之间，以便增加连接器的高度。 在一些实施方式中，可以在夹层连接器的第一和第二部件分别安装在主机卡和夹层卡上的同时执行插入件的安装，使得插入件在第一和第二部件之间的安装增加间隔 主机卡和夹层卡之间。

    Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof
    6.
    发明授权
    Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof 有权

    公开(公告)号：US10923876B1

    公开(公告)日：2021-02-16

    申请号：US16536492

    申请日：2019-08-09

    Applicant: Lockheed Martin Corporation

    Inventor： Aleksandra Shepsis ,  David L. Vos

    IPC: H01S3/04 ,  H01S5/024

    Abstract: A heat exchanger configured to cool an energy output device, and systems, devices, and methods thereof, can comprise a heat exchanger housing and an internal chamber defined in the housing that is configured to be filled with a phase-change material (PCM). The internal chamber can be provided at a first predetermined level inside the housing relative to the top surface of the housing and can extend under a first predetermined portion of the top surface of the housing. The internal chamber can include a plurality of PCM channels configured to be filled with the PCM and to accommodate phase changes of the PCM in multiple phase-change directions. Optionally, the plurality of PCM channels can be defined by a plurality of fins and/or the internal chamber can be accessible to outside the housing via at least one PCM interface configured to receive and pass therethrough the PCM.

    Process for making an apparatus with fluid-flow-through cooling of circuit boards
    8.
    发明授权
    Process for making an apparatus with fluid-flow-through cooling of circuit boards 有权

    公开(公告)号：US10362713B2

    公开(公告)日：2019-07-23

    申请号：US15169827

    申请日：2016-06-01

    Applicant: Lockheed Martin Corporation

    Inventor： Brian W. Kaplun ,  James S. Eiche ,  David L. Vos

    IPC: H05K7/20 ,  B23P15/26

    Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

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