Invention Grant
- Patent Title: Semiconductor device and a method for fabricating the same
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Application No.: US16206803Application Date: 2018-11-30
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Publication No.: US10916475B2Publication Date: 2021-02-09
- Inventor: Jui-Yao Lai , Ying-Yan Chen , Yen-Ming Chen , Sai-Hooi Yeong , Yung-Sung Yen , Ru-Gun Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/768 ; H01L29/66 ; H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/417 ; H01L23/535

Abstract:
A semiconductor device includes a first gate structure, a second gate structure, a first source/drain structure and a second source/drain structure. The first gate structure includes a first gate electrode and a first cap insulating layer disposed on the first gate electrode. The second gate structure includes a second gate electrode and a first conductive contact layer disposed on the first gate electrode. The first source/drain structure includes a first source/drain conductive layer and a second cap insulating layer disposed over the first source/drain conductive layer. The second source/drain structure includes a second source/drain conductive layer and a second conductive contact layer disposed over the second source/drain conductive layer.
Public/Granted literature
- US20190115261A1 SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2019-04-18
Information query
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