Invention Grant
- Patent Title: Connector assembly for liquid cooling
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Application No.: US16295883Application Date: 2019-03-07
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Publication No.: US10921070B2Publication Date: 2021-02-16
- Inventor: Chao-Jung Chen , Chih-Hsiang Lee , Chih-Ming Chen , Yen-Yu Liu
- Applicant: QUANTA COMPUTER INC.
- Applicant Address: TW Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F28F9/02 ; H05K7/14 ; H05K7/20

Abstract:
The present disclosure describes a connector assembly for a liquid manifold within a server rack. The connector assembly includes a pipe configured to connect to the liquid manifold. The pipe has a flexible portion configured to accommodate at least one of lateral or vertical manipulation of the pipe while the pipe remains connected to the liquid manifold. The connector assembly further includes a first connector and a second connector configured to form a liquid-tight connection when coupled together. One of the first connector and the second connector is connected to a distal end of the pipe. The other of the first connector and the second connector is configured to connect to a component within the server rack, for supplying coolant from the liquid manifold to the component.
Information query