- 专利标题: Curable organopolysiloxane composition and semiconductor device
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申请号: US16488291申请日: 2018-02-02
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公开(公告)号: US10927278B2公开(公告)日: 2021-02-23
- 发明人: Ryosuke Yamazaki , Kazuhiro Nishijima , Tomohiro Iimura , Manabu Sutoh
- 申请人: Dow Corning Toray Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Dow Corning Toray Co., Ltd.
- 当前专利权人: Dow Corning Toray Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Howard & Howard Attorneys PLLC
- 优先权: JPJP2017-035450 20170227
- 国际申请: PCT/JP2018/003534 WO 20180202
- 国际公布: WO2018/155131 WO 20180830
- 主分类号: C09J183/04
- IPC分类号: C09J183/04 ; H01L33/48 ; H01L23/00
摘要:
The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0