Curable silicone composition for die bonding use

    公开(公告)号:US11384268B2

    公开(公告)日:2022-07-12

    申请号:US16619343

    申请日:2018-06-19

    摘要: A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.

    Method for producing sealed optical semiconductor device

    公开(公告)号:US11257992B2

    公开(公告)日:2022-02-22

    申请号:US16637531

    申请日:2018-08-31

    IPC分类号: H01L33/52 H01L33/50

    摘要: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan δ) of 1.6 or more at the temperature T2.

    Silicone rubber composition and composite made therefrom

    公开(公告)号:US10968375B2

    公开(公告)日:2021-04-06

    申请号:US16311235

    申请日:2017-06-15

    摘要: A silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl group, at least one silicon-bonded hydrogen atom, and free of an alkenyl group, or a mixture of components (B-1) and (B-2) an organosiloxane having in a molecule at least one aryl group and at least one alkenyl group; (C) an acrylic compound or a methacrylic compound; (D) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule and free of an aryl group and an alkenyl group; and (E) a hydrosilylation reaction catalyst. The silicone rubber composition exhibits excellent adhesive properties with respect to diverse organic resins it comes into contact with during its cure, and at the same time possesses excellent mold-release properties with respect to metal dies used for its molding.

    Curable organopolysiloxane composition and semiconductor device

    公开(公告)号:US10927278B2

    公开(公告)日:2021-02-23

    申请号:US16488291

    申请日:2018-02-02

    摘要: The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0