Invention Grant
- Patent Title: Vertical memory devices
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Application No.: US16514548Application Date: 2019-07-17
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Publication No.: US10930671B2Publication Date: 2021-02-23
- Inventor: Seung-Jun Shin , Bong-Hyun Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0121516 20181012
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11556 ; H01L29/423 ; H01L29/10 ; H01L27/1157

Abstract:
A vertical memory device includes a substrate having a cell array region and a staircase region. Gate electrodes are spaced apart from each other in first and third directions. A channel extends through the gate electrodes in the first direction on the cell array region. Each of the gate electrodes extends in a second direction. End portions in the second direction of one or more of the gate electrodes form a first stair structure on the staircase region of the substrate. The first stair structure includes first steps, a second step, and a third step sequentially disposed in the third direction. Each of the first steps has a first length, the second step has a second length greater than the first length, and the third step has a third length greater than the second length.
Information query
IPC分类: