Invention Grant
- Patent Title: Semiconductor devices and methods for enhancing signal integrity of an interface provided by a semiconductor device
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Application No.: US16114669Application Date: 2018-08-28
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Publication No.: US10932358B2Publication Date: 2021-02-23
- Inventor: Duen-Yi Ho , Hung-Chuan Chen , Shang-Pin Chen
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/00 ; H01L23/498 ; G06F13/40 ; H01L23/538 ; H01L23/50

Abstract:
A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
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