A band saw vice assembly for securing a substrate for cutting includes a base that has a first plate coupled to and extending vertically from a first side. A first bar, which is hollow, is coupled to and extends perpendicularly from the first plate. A second plate is coupled to and extends perpendicularly from a sleeve that is positioned around the first bar. A first slot and a second slot, which are aligned and perpendicular to the base, are positioned in the first plate and the second plate, respectively. An actuator, which is operationally coupled to the sleeve, is coupled to and positioned in the first bar. The actuator is positioned to motivate the second plate toward the first plate to frictionally couple to a substrate to fixedly position the substrate. The first and second slots are configured to insert a blade of a band saw to cut the substrate.