Invention Grant
- Patent Title: Microwave transmission apparatus and semiconductor processing device
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Application No.: US16411408Application Date: 2019-05-14
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Publication No.: US10937633B2Publication Date: 2021-03-02
- Inventor: Chunming Liu
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201611013118.3 20161115
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H7/38 ; H01P3/12 ; H01P5/02 ; H01L21/67 ; H01P3/08

Abstract:
The present disclosure provides a microwave transmission apparatus. The microwave transmission apparatus includes a waveguide, configured to transmit microwaves emitted from a microwave source to a load; and an impedance matching structure, disposed in the waveguide the waveguide. The waveguide includes a microstrip interdigital capacitor. The impedance before the input end of the impedance matching structure is matched with the impedance after the input end of the impedance matching structure by adjusting an equivalent capacitance formed by the microstrip interdigital capacitor and/or a position of the microstrip interdigital capacitor along the extending direction of the waveguide.
Public/Granted literature
- US20190267214A1 MICROWAVE TRANSMISSION APPARATUS AND SEMICONDUCTOR PROCESSING DEVICE Public/Granted day:2019-08-29
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