Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16038196Application Date: 2018-07-18
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Publication No.: US10937701B2Publication Date: 2021-03-02
- Inventor: Feng-Yi Chang , Shih-Fang Tzou , Yu-Cheng Tung , Ming-Feng Kuo , Li-Chiang Chen
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu; CN Quanzhou
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu; CN Quanzhou
- Agent Winston Hsu
- Priority: CN201710308679.4 20170504
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/8234

Abstract:
A semiconductor device includes a first gate structure in a substrate and a second gate structure in the substrate and adjacent to the first gate structure. Preferably, a top surface of the first gate structure and a top surface of the second gate structure are lower than a top surface of the substrate and a number of work function metal layers in the first gate structure and the second gate structure are different.
Public/Granted literature
- US20180342425A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-11-29
Information query
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