Invention Grant
- Patent Title: Soft magnetic alloy and magnetic device
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Application No.: US15905027Application Date: 2018-02-26
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Publication No.: US10943718B2Publication Date: 2021-03-09
- Inventor: Kazuhiro Yoshidome , Hiroyuki Matsumoto , Kenji Horino , Akito Hasegawa , Yu Yonezawa , Syota Goto , Hajime Amano
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-035387 20170227
- Main IPC: H01F1/153
- IPC: H01F1/153 ; C22C45/02 ; C22C38/16 ; C22C33/00 ; C22C38/18 ; C22C38/02 ; C22C38/00 ; C22C38/12 ; C22C33/04 ; H01F41/02

Abstract:
Provided is a soft magnetic alloy including Fe, as a main component, and including C. the soft magnetic alloy includes an Fe composite network phase having Fe-rich grids connected in a continuous measurement range including 80000 grids, each of which size is 1 nm×1 nm×1 nm. An average of C content ratio of the Fe-poor grids having cumulative frequency of 90% or more from lower C content is 5.0 times or more to an average of C content ratio of the whole soft magnetic alloy.
Public/Granted literature
- US20180247745A1 SOFT MAGNETIC ALLOY AND MAGNETIC DEVICE Public/Granted day:2018-08-30
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