Invention Grant
- Patent Title: Conductive polymer dispersion for improved reliability
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Application No.: US16435762Application Date: 2019-06-10
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Publication No.: US10943742B2Publication Date: 2021-03-09
- Inventor: Ajaykumar Bunha , Antony P. Chacko , Yaru Shi , Qingping Chen , Philip M. Lessner
- Applicant: KEMET Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Patent Filing Specialist Inc.
- Agent Joseph T. Guy
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/042 ; C09D125/18 ; C09D5/24 ; C09D4/06 ; C09D165/00 ; C08F212/14 ; C08F12/30 ; C09D133/14 ; C09D7/65 ; H01G9/15 ; H01G9/025

Abstract:
A capacitor, and process for forming a capacitor, is described wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
Public/Granted literature
- US20190311857A1 Conductive Polymer Dispersion for Improved Reliability Public/Granted day:2019-10-10
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