Invention Grant
- Patent Title: Semiconductor package device and method of forming package body
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Application No.: US15490817Application Date: 2017-04-18
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Publication No.: US10943800B2Publication Date: 2021-03-09
- Inventor: Fan-Yu Min , Chao-Hung Weng , Liang-Chun Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/56
Abstract:
An apparatus for packaging a semiconductor device is provided. The apparatus includes a first mold, a second mold and a support element. The first mold includes a plate. The second mold includes a carrier disposed corresponding to the plate. The carrier defines a hole penetrating the carrier. The support element is engaged with the hole for supporting an object to be molded.
Public/Granted literature
- US20180301361A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF FORMING PACKAGE BODY Public/Granted day:2018-10-18
Information query
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