Invention Grant
- Patent Title: Semiconductor device with a protection mechanism and associated systems, devices, and methods
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Application No.: US16775163Application Date: 2020-01-28
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Publication No.: US10943842B2Publication Date: 2021-03-09
- Inventor: Wei Zhou , Bret K. Street , Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/10 ; H01L25/065 ; H01L23/04 ; H01L25/00
Abstract:
A semiconductor device includes a substrate including a substrate top surface; interconnects connected to the substrate and extending above the substrate top surface; a die attached over the substrate, wherein the die includes a die bottom surface that connects to the interconnects for electrically coupling the die and the substrate; and a metal enclosure directly contacting and vertically extending between the substrate top surface and the die bottom surface, wherein the metal enclosure peripherally surrounds the interconnects.
Public/Granted literature
- US20200168517A1 SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS Public/Granted day:2020-05-28
Information query
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