Invention Grant
- Patent Title: High density interconnection using fanout interposer chiplet
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Application No.: US15817054Application Date: 2017-11-17
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Publication No.: US10943869B2Publication Date: 2021-03-09
- Inventor: Jun Zhai , Chonghua Zhong , Kunzhong Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/683 ; H01L23/498 ; H01L25/00 ; H01L23/16 ; H01L23/00 ; H01L25/10 ; H01L25/065 ; H01L25/18 ; H01L23/31

Abstract:
Multiple component package structures are described in which an interposer chiplet is integrated to provide fine routing between components. In an embodiment, the interposer chiplet and a plurality of conductive vias are encapsulated in an encapsulation layer. A first plurality of terminals of the first and second components may be in electrical connection with the plurality of conductive pillars and a second plurality of terminals of first and second components may be in electrical connection with the interposer chiplet.
Public/Granted literature
- US20180358298A1 HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET Public/Granted day:2018-12-13
Information query
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