Invention Grant
- Patent Title: Substrate and manufacturing method therefor, and electronic apparatus
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Application No.: US16481482Application Date: 2018-12-17
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Publication No.: US10943957B2Publication Date: 2021-03-09
- Inventor: Lujiang Huangfu , Libin Liu , Yipeng Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dave Law Group LLC
- Agent Raj S. Dave
- Priority: CN201711376371.X 20171219
- International Application: PCT/CN2018/121508 WO 20181217
- International Announcement: WO2019/120168 WO 20190627
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/11 ; H01L27/01

Abstract:
A substrate and a method of manufacturing the same, and an electronic apparatus are provided. The substrate includes: a base substrate, a peripheral circuit, and a common electrode lead. The base substrate includes a working area, a non-working area located outside the working area, and an outer contour edge, the non-working area including a peripheral circuit area adjacent to the working area and a non-circuit area away from the working area; the peripheral circuit being arranged in the peripheral circuit area; the common electrode lead being arranged along at least a portion of the outer contour edge of the base substrate; the common electrode lead being arranged in the non-working area and extending along at least the portion of the outer contour edge; the peripheral circuit area being provided with the peripheral circuit, and the peripheral circuit being absent in the non-circuit area.
Information query
IPC分类: