Invention Grant
- Patent Title: Laser apparatus and method of dicing a substrate using the same
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Application No.: US16517789Application Date: 2019-07-22
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Publication No.: US10946483B2Publication Date: 2021-03-16
- Inventor: Young-Chul Kwon , Man-Hee Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0031062 20190319
- Main IPC: B23K26/53
- IPC: B23K26/53 ; H01L21/78 ; B23K26/06 ; B23K26/073 ; B23K26/067 ; B23K26/08 ; B23K26/70

Abstract:
A laser apparatus may include a spectrum controller and a spectrum modulator. The spectrum controller may control a center wavelength and/or a bandwidth of a spectrum of a laser beam. The spectrum modulator may modulate the spectrum of the laser beam having the center wavelength and/or the bandwidth controlled by the spectrum controller. Thus, the laser beam may have the spectrum optimal for a semiconductor fabrication process. Particularly, the substrate may be accurately diced using the laser beam having the optimal spectrum.
Public/Granted literature
- US20200298346A1 LASER APPARATUS AND METHOD OF DICING A SUBSTRATE USING THE SAME Public/Granted day:2020-09-24
Information query
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