Invention Grant
- Patent Title: Semiconductor component and method for producing same
-
Application No.: US16142826Application Date: 2018-09-26
-
Publication No.: US10947109B2Publication Date: 2021-03-16
- Inventor: Mathias Vaupel , Bernhard Knott , Horst Theuss
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Design IP
- Priority: DE102017123175.7 20171005
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; H01L23/04 ; H01L23/24 ; H01L23/498 ; H01L23/16 ; B81C1/00 ; H01L21/311 ; H01L21/52 ; H01L21/56 ; H01L23/055 ; H01L23/31 ; H01L23/495 ; H01L23/00
Abstract:
A method for producing a semiconductor component is proposed. The method includes providing a housing. At least one semiconductor chip is arranged in a cavity of the housing. Furthermore, an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire. The method furthermore includes applying a protective material on the electrical contact of the semiconductor chip and also on a region of the bond wire which is adjacent to the electrical contact of the semiconductor chip, and/or on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing. Moreover, the method also includes filling at least one partial region of the cavity with a gel.
Public/Granted literature
- US20190106321A1 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME Public/Granted day:2019-04-11
Information query
IPC分类:
