Invention Grant
- Patent Title: Smart performance of spill fill data transfers in computing environments
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Application No.: US15678592Application Date: 2017-08-16
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Publication No.: US10956359B2Publication Date: 2021-03-23
- Inventor: Marek Targowski , Konrad Trifunovic
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F15/80 ; G06T1/20 ; G06N5/02 ; G06F9/50

Abstract:
A mechanism is described for facilitating smart spill/fill data transfers in computing environments. A method of embodiments, as described herein, includes facilitating dividing a kernel into regions including low pressure regions and high pressure regions, where the low pressure regions are associated with low use of registers hosted by a processor of a computing device, while the high pressure regions are associated with high use of the registers. The method may further include transferring of data between memory and the registers based on at least one of the low pressure regions and the high pressure regions.
Public/Granted literature
- US20190057061A1 SMART PERFORMANCE OF SPILL FILL DATA TRANSFERS IN COMPUTING ENVIRONMENTS Public/Granted day:2019-02-21
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