Invention Grant
- Patent Title: Polycrystalline diamond compact
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Application No.: US16667597Application Date: 2019-10-29
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Publication No.: US10961785B2Publication Date: 2021-03-30
- Inventor: Kenneth E. Bertagnolli , David P. Miess , Jiang Qian , Jason K. Wiggins , Michael A. Vail , Debkumar Mukhopadhyay
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- Main IPC: E21B10/567
- IPC: E21B10/567 ; B22F7/08 ; C22C26/00 ; E21B10/573 ; E21B10/46 ; E21B10/55 ; E21B10/36 ; F16C33/04 ; F16C17/02 ; F16C17/04 ; F16C33/26 ; B24D18/00 ; F16C17/10

Abstract:
In an embodiment, a method of fabricating a polycrystalline diamond compact is disclosed. The method includes sintering a plurality of diamond particles in the presence of a metal-solvent catalyst to form a polycrystalline diamond body; leaching the polycrystalline diamond body to at least partially remove the metal-solvent catalyst therefrom, thereby forming an at least partially leached polycrystalline diamond body; and subjecting an assembly of the at least partially leached polycrystalline diamond body and a cemented carbide substrate to a high-pressure/high-temperature process at a pressure to infiltrate the at least partially leached polycrystalline diamond body with an infiltrant. The pressure of the high-pressure/high-temperature process is less than that employed in the act of sintering of the plurality of diamond particles.
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