Invention Grant
- Patent Title: Low power PCIe
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Application No.: US16155824Application Date: 2018-10-09
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Publication No.: US10963035B2Publication Date: 2021-03-30
- Inventor: Lalan Jee Mishra , James Lionel Panian , Richard Dominic Wietfeldt , Mohit Kishore Prasad , Amit Gil , Shaul Yohai Yifrach
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: G06F1/3234
- IPC: G06F1/3234 ; G06F13/40 ; G06F13/10 ; G06F1/3206

Abstract:
A system for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems, while maintaining both lower level physical layer (PHY) pin requirements and upper layer functionality being capable of both differential and single-ended signaling modes optimized for power savings. An apparatus includes an integrated circuit (IC) adapted to be connected to a Peripheral Component Interconnect (PCI) Express (PCIe) bus. The IC includes a control block selects between differential and single-ended signaling for the PCIe bus. The single-ended signaling is transmitted through existing pins of the IC that are coupled to the PCIe bus for differential signaling when single-ended signaling is selected for the PCIe bus.
Public/Granted literature
- US20190107882A1 LOW POWER PCIE Public/Granted day:2019-04-11
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