An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.