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公开(公告)号：US20210083390A1
公开(公告)日：2021-03-18
申请号：US17097637
申请日：2020-11-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
IPC: H01Q9/26 , G06K19/077 , H01Q1/00 , H01Q1/38
Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, an antenna pattern provided on the base material, and an expansion member. The expansion member is disposed adjacent to the antenna pattern and has a coefficient of linear expansion that is higher than coefficients of linear expansion of the antenna pattern. When the RFID tag is subjected to an electromagnetic wave heating microwave, and thus the temperature of each portion rises, the antenna pattern breaks at a position of the expansion member. With this configuration, ignition and combustion are able to be prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while being attached to the food item.
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公开(公告)号：US09917367B2
公开(公告)日：2018-03-13
申请号：US14994557
申请日：2016-01-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Hirokazu Yazaki
CPC classification number: H01Q7/06 , H01Q1/2208 , H01Q1/523 , H01Q21/08
Abstract: An antenna device includes a power supply coil including wire patterns provided on or in magnetic layers and antenna coils including wire patterns provided on or in the magnetic layers. The power supply coil and the antenna coils include coil winding axes thereof coinciding with a lamination direction of the magnetic layers and generate magnetic field coupling to each other. The power supply coil is located on an inner side portion relative to the antenna coils when seen in the lamination direction. At least portions of the antenna coils are located on outer side portions relative to the power supply coil in the lamination direction. With this, an antenna device and a communication apparatus capable of communicating with a communication party reliably without forming an unnecessary communication path with a party-side coil are provided.
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公开(公告)号：US09281797B2
公开(公告)日：2016-03-08
申请号：US14619497
申请日：2015-02-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
IPC: H01P5/18 , H01P1/23 , H03H7/24 , H03H7/38 , H01P1/201 , H01P1/22 , H01P1/203 , H03H7/06 , H03H1/00
CPC classification number: H03H7/38 , H01P1/201 , H01P1/20345 , H01P1/22 , H03H7/06 , H03H7/24 , H03H2001/0085
Abstract: A high-frequency device includes a substrate including a plurality of layers that are stacked on top of one another and that include dielectric and magnetic layers, terminals, pattern conductors each formed on one layer, and via conductors each extending through one layer. The pattern conductors and via conductors connect the terminals and form a signal line that transmits a high-frequency signal. A first portion of the signal line includes a via conductor extending through one magnetic layer and/or a pattern conductor sandwiched between two magnetic layers and has a predetermined resistance to the high-frequency signal. A second portion of the signal line includes a capacitor formed of two pattern electrodes with at least one dielectric layer and no magnetic layers sandwiched there between and/or an inductor including a pattern conductor formed on a dielectric layer. The high-frequency device has an impedance to the high-frequency signal at the terminals.
Abstract translation: 高频器件包括：基板，其包括层叠在彼此顶部的多个层，并且包括电介质层和磁性层，端子，各自形成在一个层上的图案导体，以及每个延伸通过一层的通孔导体。 图案导体和通孔导体连接端子并形成发送高频信号的信号线。 信号线的第一部分包括延伸穿过一个磁性层的通孔导体和/或夹在两个磁性层之间的图案导体，并且具有对高频信号的预定电阻。 信号线的第二部分包括由具有至少一个电介质层的两个图案电极形成的电容器，并且不夹在其间的磁性层和/或包括形成在电介质层上的图案导体的电感器。 高频器件对端子处的高频信号具有阻抗。
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公开(公告)号：US20150155848A1
公开(公告)日：2015-06-04
申请号：US14619497
申请日：2015-02-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
CPC classification number: H03H7/38 , H01P1/201 , H01P1/20345 , H01P1/22 , H03H7/06 , H03H7/24 , H03H2001/0085
Abstract: A high-frequency device includes a substrate including a plurality of layers that are stacked on top of one another and that include dielectric and magnetic layers, terminals, pattern conductors each formed on one layer, and via conductors each extending through one layer. The pattern conductors and via conductors connect the terminals and form a signal line that transmits a high-frequency signal. A first portion of the signal line includes a via conductor extending through one magnetic layer and/or a pattern conductor sandwiched between two magnetic layers and has a predetermined resistance to the high-frequency signal. A second portion of the signal line includes a capacitor formed of two pattern electrodes with at least one dielectric layer and no magnetic layers sandwiched there between and/or an inductor including a pattern conductor formed on a dielectric layer. The high-frequency device has an impedance to the high-frequency signal at the terminals.
Abstract translation: 高频器件包括：基板，其包括层叠在彼此顶部的多个层，并且包括电介质层和磁性层，端子，各自形成在一个层上的图案导体，以及每个延伸通过一层的通孔导体。 图案导体和通孔导体连接端子并形成发送高频信号的信号线。 信号线的第一部分包括延伸穿过一个磁性层的通孔导体和/或夹在两个磁性层之间的图案导体，并且具有对高频信号的预定电阻。 信号线的第二部分包括由具有至少一个电介质层的两个图案电极形成的电容器，并且不夹在其间的磁性层和/或包括形成在电介质层上的图案导体的电感器。 高频器件对端子处的高频信号具有阻抗。
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公开(公告)号：US08810352B2
公开(公告)日：2014-08-19
申请号：US13955505
申请日：2013-07-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomoya Yokoyama , Takako Sato , Akihiro Ieda , Shigetoshi Hayashi , Hirokazu Yazaki
CPC classification number: H01F27/29 , H01F3/14 , H01F17/0033 , H01F27/292 , H01F41/04 , H01F41/046 , Y10T29/4902
Abstract: In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.
Abstract translation: 在层叠电感器元件中，外部电极和端子电极通过通孔，内部布线和端面电极电连接。 上表面侧的通孔设置在外部电极的正下方和非磁性铁氧体层的下方。 下表面侧的通孔设置在端子电极的正上方和非磁性铁氧体层。 由于最外层由非磁性铁氧体层限定，即使最外层设置有通孔，寄生电感也不会增加。 在这种情况下，内部布线不会在元件的表面上布线。 因此，不存在布线图案的复杂化，可以防止元件的安装面积的增大。
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Patent Agency Ranking
公开(公告)号：US08536956B2
公开(公告)日：2013-09-17
申请号：US13754956
申请日：2013-01-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ikuo Tamaru , Hirokazu Yazaki , Hiroshi Masuda
Abstract: In a directional coupler, sub-lines or main lines are electromagnetically coupled to each other to degrade isolation characteristics. A capacitor is located between the sub-lines or between the main lines to cause the isolation characteristics to have poles in order to improve the isolation characteristics of the directional coupler.
Abstract translation: 在定向耦合器中，子线或主线彼此电磁耦合以降低隔离特性。 电容器位于子线之间或主线之间，以使得隔离特性具有极点，以便改善定向耦合器的隔离特性。
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公开(公告)号：US11379704B2
公开(公告)日：2022-07-05
申请号：US17143461
申请日：2021-01-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Hirokazu Yazaki
IPC: G06K19/077 , G06K19/07
Abstract: An RFID tag is providing for transmitting and receiving a communication signal. The RFID tag includes a base material, antenna patterns formed on the base material, and an RFIC package connected to the antenna patterns. The antenna patterns are defined by conductor patterns. The whole of the antenna patterns resonate at a communication frequency, and each of the plurality of conductor patterns has a line length that does not cause resonance at a frequency in a microwave band for electromagnetic wave heating higher than the communication frequency.
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公开(公告)号：US10964645B2
公开(公告)日：2021-03-30
申请号：US16538942
申请日：2019-08-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Keito Yonemori
IPC: H01L23/552 , B32B15/08 , B32B27/38 , H01L23/29 , H01L23/31 , H05K1/02 , H05K3/28 , H05K5/06 , H05K9/00
Abstract: An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.
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公开(公告)号：US10324502B2
公开(公告)日：2019-06-18
申请号：US15861708
申请日：2018-01-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
Abstract: A speaker module includes a DC-DC converter device including a switching circuit device and a choke coil connected to the switching circuit device and a speaker device that converts an electric signal generated using output voltage from the DC-DC converter device into sound. A magnetic substrate which includes the choke coil and on which the switching circuit device is mounted is disposed between the switching circuit device and the speaker device.
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公开(公告)号：US10264676B2
公开(公告)日：2019-04-16
申请号：US16128573
申请日：2018-09-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Keito Yonemori
Abstract: A passive element array includes an element body including laminated base material layers, first and second passive elements arranged in the element body perpendicular or substantially perpendicular to a lamination direction of the plurality of base material layers, a pair of first input/output terminals provided at one main surface of the element body and connected to the first passive element and a pair of second input/output terminals provided at the other main surface of the element body and connected to the second passive element.
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