Invention Grant
- Patent Title: Multi-chip package, controlling method of multi-chip package and security chip
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Application No.: US15998456Application Date: 2018-08-15
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Publication No.: US10969991B2Publication Date: 2021-04-06
- Inventor: Chia-Jung Chen , Chin-Hung Chang , Ken-Hui Chen
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
A multi-chip package, a controlling method of the multi-chip package and a security chip are provided. The multi-chip package includes a memory chip and a security chip. The security chip is coupled between the memory chip and a host. The security chip includes a processing circuit. The processing circuit is for enabling a security path to input an input-output signal into the processing circuit for executing a security procedure and accessing the memory chip, if a command is received by the processing circuit and the command includes a security requirement.
Public/Granted literature
- US20200057575A1 Multi-chip package, controlling method of multi-chip package and security chip Public/Granted day:2020-02-20
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